Patent Assignment
Reel/Frame 037046/0074
Assignment of Assignor's Interest
Recorded: 2015-11-16
Pages: 6
Assignee
SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
9 BATTERY ROAD, #15-01 STRAITS TRADING BUILDING, SINGAPORE, 049910, SINGAPORE
Covered Property
(1)
Clamping Apparatus for Cleaving a Bonded Wafer Structure and Methods for Cleaving
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.