IP Library Assignment 037046/0074
Patent Assignment
Reel/Frame 037046/0074

Assignment of Assignor's Interest

Recorded: 2015-11-16 Pages: 6
Assignors
YOUNG, GREGORY A.
Executed: 2015-10-19
LIBBERT, JEFFREY L.
Executed: 2015-10-21
Assignee
SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
9 BATTERY ROAD, #15-01 STRAITS TRADING BUILDING, SINGAPORE, 049910, SINGAPORE
Covered Property (1)
Clamping Apparatus for Cleaving a Bonded Wafer Structure and Methods for Cleaving
Patent: 9,925,755 →
Application: 14/845,327 →
Publication: US 2015/0375495
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →