Patent Assignment
Reel/Frame 037049/0640
Assignment of Assignor's Interest
Recorded: 2015-11-16
Pages: 4
Assignors
LIU, ZI-JHENG
Executed: 2015-11-09
KUO, CHEN-CHENG
Executed: 2015-11-09
LIU, CHUNG-SHI
Executed: 2015-11-09
KUO, HUNG-JUI
Executed: 2015-11-09
HU, YU-HSIANG
Executed: 2015-11-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Chip Packages and Methods of Manufacture Thereof