IP Library › Assignment 037058/0456
Patent Assignment
Reel/Frame 037058/0456

Assignment of Assignor's Interest

Recorded: 2015-11-17 Pages: 4
Assignors
KUO, YANG-KUAO
Executed: 2015-11-03
YU, YI-HSIUAN
Executed: 2015-11-03
RUAN, JIAN-LONG
Executed: 2015-11-03
Assignee
NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
NO. 481, JIA-AN SEC., ZHONGZHENG RD.,, JIA-AN VILLAGE., LONGTAN DIST.,, TAOYUAN CITY, 325, TAIWAN
Covered Property (1)
Aluminum Nitride Electrostatic Chuck Used in High Temperature and High Plasma Power Density Semiconductor Manufacturing Process
Patent: 9,972,520 →
Application: 14/943,290 →
Publication: US 2017/0140969