Patent Assignment
Reel/Frame 037063/0354
Assignment of Assignor's Interest
Recorded: 2015-11-17
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Package Structure and Method for Forming Same