IP Library › Assignment 037064/0487
Patent Assignment
Reel/Frame 037064/0487

Assignment of Assignor's Interest

Recorded: 2015-11-17 Pages: 3
Assignors
LEE, TUNG-YING
Executed: 2015-11-10
YEH, CHIH-CHIEH
Executed: 2015-11-10
HSU, CHEN-FENG
Executed: 2015-11-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Structure and Formation Method of Semiconductor Device Structure
Application: 14/942,639 →
Publication: US 2017/0141188