IP Library Assignment 037072/0084
Patent Assignment
Reel/Frame 037072/0084

Assignment of Assignor's Interest

Recorded: 2015-11-18 Pages: 4
Assignor
HASHIMOTO, KIYOAKI
Executed: 2015-11-11
Assignee
J-DEVICES CORPORATION
1913-2 FUKURA, USUKI-CITY, OITA, 875-0053, JAPAN
Covered Property (1)
Semiconductor Package to Reduce Warping
Application: 14/944,480 →
Publication: US 2016/0172265
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 25, 2020
From: J-DEVICES CO., LTD.
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 053597/0184 →
Corrective Assignment to Correct the Conveying Party Name Previously Recorded at Reel: 53597 Frame: 184. Assignor(S) Hereby Confirms the Assignment. Mar 5, 2021
From: J-DEVICES CORPORATION
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 055605/0060 →