Patent Assignment
Reel/Frame 055605/0060
Corrective Assignment to Correct the Conveying Party Name Previously Recorded at Reel: 53597 Frame: 184. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2021-03-05
Pages: 21
Assignor
J-DEVICES CORPORATION
Executed: 2020-01-01
Assignee
AMKOR TECHNOLOGY JAPAN, INC.
1913-2, TAKEGASHITA, FUKURA, USUKI-SHI, OITA, 875-0053, JAPAN
Covered Properties
(36)
Semiconductor Device
Semiconductor Device and Manufacturing Method Thereof
Semiconductor Device and Manufacturing Method Thereof
Semiconductor Device, Semiconductor Module Structure Configured by Vertically Stacking Semiconductor Devices, and Manufacturing Method Thereof
Application:
13/556,448 →
Publication:
US 2013/0026650
Semiconductor Device and Manufacturing Method Thereof
Semiconductor Module
Application:
13/778,936 →
Publication:
US 2013/0256865
Semiconductor Storage Device and Method for Producing the Same
Semiconductor Device and Method for Producing the Same
Semiconductor Device and Method of Manufacturing the Same
Semiconductor Device, Semiconductor Stacked Module Structure, Stacked Module Structure and Method of Manufacturing Same
Semiconductor Device
Application:
14/620,854 →
Publication:
US 2015/0243576
Semiconductor Package
Semiconductor Package
Heat Sink in the Aperture of Substrate
Semiconductor Device and Method of Manufacturing Semiconductor Device
Semiconductor Device, Semiconductor Stacked Module Structure, Stacked Module Structure and Method of Manufacturing Same
Semiconductor Package to Reduce Warping
Magnetic Shielding Package of Non-Volatile Magnetic Memory Element
Semiconductor Device
Semiconductor Device Having Heat Sink Having Stress Absorbing Part
Application:
15/018,563 →
Publication:
US 2016/0233141
Semiconductor Package and Manufacturing Method Thereof
Semiconductor Device and Method for Manufacturing Same
Method for Manufacturing a Semiconductor Package
Method for Manufacturing Semiconductor Package, and Semiconductor Package
Application:
15/375,241 →
Publication:
US 2017/0207157
Method of Manufacturing Semiconductor Package and Semiconductor Package
Application:
15/409,631 →
Publication:
US 2017/0256453
Interconnect Structure, Printed Circuit Board, Semiconductor Device, and Manufacturing Method for Interconnect Structure
Semiconductor Package
Semiconductor Package and Method for Producing Same
Application:
15/585,659 →
Publication:
US 2017/0373012
Semiconductor Manufacturing Apparatus Having a Pickup Unit Simultaneosly Picking Up a Plurality of Semiconductor Chips
Manufacturing Method of Semiconductor Package
Application:
15/621,493 →
Publication:
US 2017/0358462
Manufacturing Method of Semiconductor Package
Semiconductor Device
Method for Producing a Semiconductor Package
Semiconductor Device
Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
Semiconductor Devices Including Shielding Layer and Methods of Manufacturing Semiconductor Devices
Related Assignments
(23)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 6, 2011
From: IMAIZUMI, YUKARI; KAWAZU, GOSHI; KUDO, ISAO; KATSUMATA, AKIO
To: J-DEVICES CORPORATION; TOSHIBA CORPORATION
Reel/Frame 026451/0052 →
Assignment of Assignor's Interest
Jun 7, 2011
From: YAMAGATA, OSAMU
To: J-DEVICES CORPORATION
Reel/Frame 026451/0142 →
Assignment of Assignor's Interest
Jun 8, 2011
From: MARUTANI, HISAKAZU; IWAMI, YASUNARI; CHIKAI, TOMOSHIGE; TAKAHSHI, TOMOKO
To: J-DEVICES
Reel/Frame 026465/0188 →
Record to Correct Fourth Inventor's Name to Specify Tomoko Takahashi. Previously Recorded on Reel 026465, Frame 0188.
Aug 4, 2011
From: MARUTANI, HISAKAZU; IWAMI, YASUNARI; CHIKAI, TOMOSHIGE; TAKAHASHI, TOMOKO
To: J-DEVICES
Reel/Frame 026724/0437 →
Assignment of Assignor's Interest
Sep 18, 2012
From: SAWACHI, SHIGENORI; YAMAGATA, OSAMU; INOUE, HIROSHI; ITAKURA, SATORU
To: J-DEVICES CORPORATION
Reel/Frame 028976/0009 →
Assignment of Assignor's Interest
Sep 18, 2012
From: YAMAGATA, OSAMU; KATSUMATA, AKIO; INOUE, HIROSHI; SAWACHI, SHIGENORI
To: J-DEVICES CORPORATION
Reel/Frame 028978/0513 →
Assignment of Assignor's Interest
Feb 27, 2013
From: UMEKI, AKIHIRO; HIRUTA, YOICHI
To: J-DEVICES CORPORATION
Reel/Frame 029887/0723 →
Assignment of Assignor's Interest
Nov 1, 2013
From: ITAKURA, SATORU; KATSUMATA, AKIO; UMEKI, AKHIRO; SHIRAISHI, YASUSHI
To: J-DEVICES CORPORATION
Reel/Frame 031656/0499 →
Record to Correct the Third Assignor's Name to Akihiro Umeki, Previously Recorded at Reel 031656, Frame 0499.
Dec 11, 2013
From: ITAKURA, SATORU; KATSUMATA, AKIO; UMEKI, AKIHIRO; SHIRAISHI, YASUSHI
To: J-DEVICES CORPORATION
Reel/Frame 032057/0192 →
Assignment of Assignor's Interest
Dec 23, 2013
From: TOMONAGA, YOSHIYUKI; OOIDA, MITSURU; WATANABE, KATSUMI; SATO, HIDENARI
To: J-DEVICES CORPORATION
Reel/Frame 032081/0926 →
Assignment of Assignor's Interest
Jan 14, 2014
From: SUDA, TORU
To: J-DEVICES CORPORATION
Reel/Frame 031961/0556 →
Record to Correct Assignee's Address to Specify J-Devices Corporation, 1913-2 Fukura, Usuki-City, Oita, 875-0053, Japan, Previously Recorded at Reel 032081, Frame 0926.
Feb 19, 2014
From: TOMONAGA, YOSHIYUKI; OOIDA, MITSURU; WATANBE, KATSUMI; SATO, HIDENARI
To: J-DEVICES CORPORATION
Reel/Frame 032365/0115 →
Assignment of Assignor's Interest
Feb 28, 2014
From: INOUE, HIROSHI; KATSUMATA, AKIO; SAWACHI, SHIGENORI; YAMAGATA, OSAMU
To: J-DEVICES CORPORATION
Reel/Frame 032324/0996 →
Assignment of Assignor's Interest
Dec 31, 2014
From: TOSHIBA CORPORATION
To: J-DEVICES CORPORATION
Reel/Frame 034606/0146 →
Assignment of Assignor's Interest
May 18, 2015
From: MIYAKOSHI, TAKESHI; HOSOYAMADA, SUMIKAZU; KUMAGAYA, YOSHIKAZU; CHIKAI, TOMOSHIGE
To: J-DEVICES CORPORATION
Reel/Frame 035662/0372 →
Assignment of Assignor's Interest
May 28, 2015
From: MIYAKOSHI, TAKESHI; HOSOYAMADA, SUMIKAZU; KUMAGAYA, YOSHIKAZU; CHIKAI, TOMOSHIGE
To: J-DEVICES CORPORATION
Reel/Frame 035736/0781 →
Assignment of Assignor's Interest
Jun 15, 2015
From: HASHIMOTO, KIYOAKI; TAKEHARA, YASUYUKI
To: J-DEVICES CORPORATION
Reel/Frame 035839/0493 →
Assignment of Assignor's Interest
Jun 19, 2015
From: HONDA, HIROKAZU; WATANABE, SHINJI; IWASAKI, TOSHIHIRO; ISHIDO, KIMINORI
To: J-DEVICES CORPORATION
Reel/Frame 035930/0411 →
Assignment of Assignor's Interest
Jul 17, 2015
From: IKEMOTO, YOSHIHIKO; INOUE, HIROSHI; ISHIDO, KIMINORI; MATSUBARA, HIROAKI
To: J-DEVICES CORPORATION
Reel/Frame 036124/0637 →
Assignment of Assignor's Interest
Nov 18, 2015
From: HASHIMOTO, KIYOAKI
To: J-DEVICES CORPORATION
Reel/Frame 037072/0084 →
Assignment of Assignor's Interest
Dec 10, 2015
From: MATSUBARA, HIROAKI; IWASAKI, TOSHIHIRO; CHIKAI, TOMOSHIGE; ISHIDO, KIMINORI
To: J-DEVICES CORPORATION
Reel/Frame 037262/0772 →
Change of Name
Aug 25, 2020
From: J-DEVICES CO., LTD.
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 053597/0184 →
Assignment of Assignor's Interest
May 17, 2024
From: INOUE, HIROSHI; KATSUMATA, AKIO; SAWACHI, SHIGENORI; YAMAGATA, OSAMU
To: J-DEVICES CORPORATION
Reel/Frame 067445/0741 →