Semiconductor device
A semiconductor device which includes a substrate, a semiconductor element arranged on the substrate, a heat dissipation component arranged on the semiconductor element, and a mold component covering an upper part of the substrate, the semiconductor element and the heat dissipation component, wherein an area of a surface on the semiconductor element of the heat dissipation component is larger than an area of a surface on which the heat dissipation component of the semiconductor element is arranged.
1. A semiconductor device comprising:
a substrate;
a semiconductor element arranged on the substrate;
a spacer arranged on the semiconductor element by an adhesive;
a mold component covering an upper part of the substrate, the semiconductor element and the spacer and
a heat dissipation component arranged on the spacer, only on one side of the semiconductor element, and buried in the mold component, the heat dissipation component being a metal material,
wherein an area of a surface of the heat dissipation component is larger than an area of a surface of the semiconductor element on which the spacer is arranged.
2. The semiconductor device according to claim 1 , wherein the heat dissipation component includes one or a plurality of stacked parts.
3. The semiconductor device according to claim 2 , wherein a surface of the heat dissipation component which is arranged on the spacer is not flat.
4. The semiconductor device according to claim 1 , wherein the adhesive is a first adhesive and wherein the heat dissipation component is fixed on the spacer by a second adhesive.
5. The semiconductor device according to claim 4 , wherein the second adhesive is grease, a thermal interface material or a paste.
6. The semiconductor device according to claim 5 , wherein a surface of the heat dissipation component which is arranged on the spacer is not flat.
7. The semiconductor device according to claim 4 , wherein a surface of the heat dissipation component which is arranged on the spacer is not flat.
8. The semiconductor device according to claim 1 , wherein the adhesive is a first adhesive and wherein the spacer is fixed on another semiconductor element which is stacked on the semiconductor element by a second adhesive.
9. The semiconductor device according to claim 8 , wherein the second adhesive is grease, a thermal interface material or a paste.
10. The semiconductor device according to claim 9 , wherein a surface of the heat dissipation component which is arranged on the semiconductor element includes bumps.
11. The semiconductor device according to claim 9 , wherein a surface of the heat dissipation component which is arranged on the semiconductor element includes slits or holes.
12. The semiconductor device according to claim 8 , wherein a surface of the heat dissipation component which is arranged on the spacer is not flat.
13. The semiconductor device according to claim 1 , wherein the adhesive is grease, a thermal interface material or a paste.
14. The semiconductor device according to claim 1 , wherein a surface of the heat dissipation component which is arranged on the spacer is not flat.
15. The semiconductor device according to claim 1 , wherein the heat dissipation component is embedded by the mold component.