Semiconductor device
A semiconductor device includes a lead frame; a circuit board located on the lead frame; a power device that includes a switching element and is mounted on the circuit board via a bump located between the power device and the circuit board; and a heat releasing member connected to the power device. The circuit board may be a multi-layer wiring board. The circuit board may include a capacitor element, a resistor element, an inductor element, a diode element and a switching element.
1. A semiconductor device, comprising:
a lead frame;
a circuit board located on the lead frame;
a power device including a switching element, the power device being mounted on the circuit board via a bump located between the power device and the circuit board;
a heat releasing member adhered to the power device by an insulating adhesive material so that the heat releasing member is electrically isolated from the power device, the heat releasing member having a first surface and a second surface opposite to the first surface, the second surface including a top surface and a side surface; and
a sealing resin covering the lead frame, the circuit board, the power device and the heat releasing member so as to expose the top surface and a top portion of the side surface,
wherein
the heat releasing member is connected to the lead frame by the first surface,
the top surface comprises convex and concave shapes,
the heat releasing member is a single-piece member that is continuous from a top of the convex and concave shapes to a first portion where the heat releasing member connects to the power device and is continuous from the top of the convex and concave shapes to a second portion where the heat releasing member connects to the lead frame, and
the convex and concave shapes have randomness.
2. The semiconductor device according to claim 1 , wherein the circuit board includes a capacitor element, a resistor element, an inductor element, a diode element and a switching element.
3. The semiconductor device according to claim 1 , wherein the circuit board includes a circuit outputting an output signal in response to an input signal, the output signal being different from the input signal.
4. The semiconductor device according to claim 1 , wherein:
the sealing resin includes a first resin and a second resin;
the first resin is located between the circuit board and the power device; and
the second resin is located so as to cover the first resin.
5. The semiconductor device according to claim 4 , wherein the first resin has a coefficient of thermal expansion closer to the coefficient of thermal expansion of the bump than the coefficient of thermal expansion of the second resin.
6. The semiconductor device according to claim 4 , wherein the first resin has a heat conductivity higher than the heat conductivity of the second resin.
7. The semiconductor device according to claim 1 , wherein the top surface has a roughened shape comprising the convex and concave shapes.
8. The semiconductor device according to claim 1 , wherein the top surface has a stain-finished shape comprising the convex and concave shapes.
9. The semiconductor device according to claim 1 , wherein the top surface has a microscopic pattern comprising the convex and concave shapes.
10. The semiconductor device according to claim 1 , wherein the top surface has a texture pattern comprising the convex and concave shapes.
11. The semiconductor device according to claim 1 , wherein a bottom of the concave shape is located above a top surface of the sealing resin.
12. A semiconductor device, comprising:
a lead frame;
a circuit board located on the lead frame;
a power device including a switching element, the power device being mounted on the circuit board via a bump located between the power device and the circuit board;
a heat releasing member adhered to the power device by an insulating adhesive material so that the heat releasing member is electrically isolated from the power device; the heat releasing member having a first surface and a second surface opposite to the first surface, the second surface including a top surface and a side surface; and
a sealing resin covering the lead frame, the circuit board, the power device and the heat releasing member so as to expose the top surface and a top portion of the side surface, wherein
the heat releasing member is connected to the lead frame by the first surface,
the heat releasing member is a single-piece member that is continuous from the top surface to a first portion where the heat releasing member connects to the power device and is continuous from the top to a second portion where the heat releasing member connects to the lead frame, and
the exposed part of the heat releasing member includes a flow path.
13. The semiconductor device according to claim 12 , wherein the flow path is formed in the heat releasing member.