Patent Assignment
Reel/Frame 037089/0109
Assignment of Assignor's Interest
Recorded: 2015-11-19
Pages: 3
Assignee
NIPPON MEKTRON, LTD.
12-15, SHIBA-DAIMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Filling Method of Conductive Paste and Manufacturing Method of Multi-Layer Printed Circuit Board
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.