Patent Assignment
Reel/Frame 037107/0395
Assignment of Assignor's Interest
Recorded: 2015-11-20
Pages: 4
Assignors
CHEN, CHUN-HENG
Executed: 2015-10-30
LIU, WAYNE
Executed: 2015-10-30
CHEN, LIANG-YIN
Executed: 2015-10-30
YU, XIONG-FEI
Executed: 2015-10-30
CHANG, HUI-CHENG
Executed: 2015-11-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Modifying Capping Layer in Semiconductor Structure