Patent Assignment
Reel/Frame 037113/0989
Assignment of Assignor's Interest
Recorded: 2015-11-23
Pages: 10
Assignors
TSAI, MING HSIEN
Executed: 2015-11-17
LIN, CHIEN-MIN
Executed: 2015-11-17
HSUEH, FU-LUNG
Executed: 2015-11-17
PU, HAN-PING
Executed: 2015-11-17
LIU, SA-LLY
Executed: 2015-11-17
HSU, SEN-KUEI
Executed: 2015-11-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
On-Chip Electromagnetic Bandgap (Ebg) Structure for Noise Suppression