IP Library › Assignment 037115/0638
Patent Assignment
Reel/Frame 037115/0638

Assignment of Assignor's Interest

Recorded: 2015-11-23 Pages: 6
Assignors
BARWICZ, TYMON
Executed: 2015-11-21
MARTIN, YVES
Executed: 2015-11-20
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Optimized Solder Pads for Solder Induced Alignment of Opto-Electronic Chips
Patent: 9,543,736 →
Application: 14/947,621 →