IP Library › Assignment 037116/0489
Patent Assignment
Reel/Frame 037116/0489

Assignment of Assignor's Interest

Recorded: 2015-11-23 Pages: 2
Assignors
WU, CHENG-HSIEN
Executed: 2015-11-17
YEH, CHIH-CHIEH
Executed: 2015-11-17
YEO, YEE-CHIA
Executed: 2015-11-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Semiconductor Device Including a Stacked Wire Structure
Patent: 9,735,274 →
Application: 14/947,650 →
Publication: US 2017/0148907