Patent Assignment
Reel/Frame 037116/0543
Assignment of Assignor's Interest
Recorded: 2015-11-23
Pages: 3
Assignors
ALBERS, SVEN
Executed: 2014-12-04
WOLTER, ANDREAS
Executed: 2014-12-08
REINGRUBER, KLAUS
Executed: 2014-12-04
MEYER, THORSTEN
Executed: 2014-12-04
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Three Dimensional Structures Within Mold Compound
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.