Patent Assignment
Reel/Frame 037128/0067
Assignment of Assignor's Interest
Recorded: 2015-11-24
Pages: 3
Assignee
KANDOU LABS, S.A.
EPFL INNOVATION PARK, BUILDING I, LAUSANNE, 1015, SWITZERLAND
Covered Property
(1)
Method and Apparatus for High Speed Chip-to-Chip Communications