Patent Assignment
Reel/Frame 037131/0935
Assignment of Assignor's Interest
Recorded: 2015-11-24
Pages: 4
Assignors
YI, LIANG
Executed: 2015-11-16
CHEN, KO-CHI
Executed: 2015-11-16
WANG, SHEN-DE
Executed: 2015-11-16
Assignee
UNITED MICROELECTRONICS CORP.
NO3, LI-HSIN RD.II, HSINCHU SCIENCE PARK, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Structure and Manufacturing Method Thereof