Patent Assignment
Reel/Frame 037134/0226
Assignment of Assignor's Interest
Recorded: 2015-11-24
Pages: 7
Assignors
SUGAKAWA, KENJI
Executed: 2015-10-30
MIMURA, YUJI
Executed: 2015-10-30
MATSUMOTO, SHUHEI
Executed: 2015-10-30
MASUNAGA, TAKAHIRO
Executed: 2015-11-02
TSUKISHIMA, MAKOTO
Executed: 2015-11-02
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Bonding Method, Storage Medium, Bonding Apparatus and Bonding System