Assignment of Assignor's Interest

Recorded: 2015-11-25 Pages: 6

Assignors

YAMAZAKI, KEISHIN

Executed: 2015-11-10

IZUMI, MANABU

Executed: 2015-11-16

NOGAMI, KATSUAKI

Executed: 2015-11-12

Assignee

HITACHI KOKUSAI ELECTRIC INC.

14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-8980, JAPAN

Covered Property (1)

Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Furnace Lid

Application: 14/949,714 →

Publication: US 2016/0076149

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.