Patent Assignment
Reel/Frame 037158/0316
Assignment of Assignor's Interest
Recorded: 2015-11-24
Pages: 6
Assignors
HO, YEN-SHIH
Executed: 2015-11-04
CHANG, SHU-MING
Executed: 2015-11-04
LIU, TSANG-YU
Executed: 2015-11-04
HUANG, YU-LUNG
Executed: 2015-11-04
LIN, CHAO-YEN
Executed: 2015-11-04
SUEN, WEI-LUEN
Executed: 2015-11-04
CHEN, CHIEN-HUI
Executed: 2015-11-04
YIU, HO-YIN
Executed: 2015-11-04
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK, JHONGLI DIST., TAOYUAN CITY, 32062, TAIWAN
Covered Property
(1)
Chip Package and Method for Forming the Same