IP Library › Assignment 037164/0306
Patent Assignment
Reel/Frame 037164/0306

Assignment of Assignor's Interest

Recorded: 2015-11-30 Pages: 7
Assignors
CAO, QING
Executed: 2015-11-25
CHENG, KANGGUO
Executed: 2015-11-25
LI, ZHENGWEN
Executed: 2015-11-25
LIU, FEI
Executed: 2015-11-25
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Three-Dimensional Integration of Neurosynaptic Chips
Application: 14/953,585 →
Publication: US 2017/0154257
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 053276/0136 →