Patent Assignment
Reel/Frame 037166/0328
Assignment of Assignor's Interest
Recorded: 2015-11-30
Pages: 6
Assignors
LEE, HO-JIN
Executed: 2015-07-13
PARK, BYUNGLYUL
Executed: 2015-07-13
PARK, JISOON
Executed: 2015-07-13
AN, JINHO
Executed: 2015-07-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Having a Tsv, a Front-Side Bumping Pad, and a Back-Side Bumping Pad