Patent Assignment
Reel/Frame 037179/0207
Assignment of Assignor's Interest
Recorded: 2015-12-01
Pages: 7
Assignors
LEE, DONG-SOO
Executed: 2015-11-04
LEE, HU-YONG
Executed: 2015-11-04
CHUNG, WON-KEUN
Executed: 2015-11-04
NA, HOON-JOO
Executed: 2015-11-04
JEON, TAEK-SOO
Executed: 2015-11-04
HYUN, SANG-JIN
Executed: 2015-11-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device Having an Interfacial Layer and Method of Manufacturing the Same