Patent Assignment
Reel/Frame 037181/0703
Assignment of Assignor's Interest
Recorded: 2015-12-01
Pages: 5
Assignors
TANABE, MASAHITO
Executed: 2015-11-05
SUGO, MICHIHIRO
Executed: 2015-11-05
YASUDA, HIROYUKI
Executed: 2015-11-05
TAGAMI, SHOHEI
Executed: 2015-11-05
KATO, HIDETO
Executed: 2015-11-05
Assignee
SHIN-ETSU CHEMICAL CO., LTD.
6-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Wafer Processing Laminate, Temporary Adhesive Material for Wafer Processing, and Method for Manufacturing Thin Wafer