Patent Assignment
Reel/Frame 037182/0987
Assignment of Assignor's Interest
Recorded: 2015-12-01
Pages: 3
Assignor
KOBAYASHI, KAZUTAKA
Executed: 2015-08-19
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Wiring Substrate, Method of Manufacturing the Same and Electronic Component Device