Patent Assignment
Reel/Frame 037192/0342
Assignment of Assignor's Interest
Recorded: 2015-12-02
Pages: 6
Assignors
YUN, JANG-GN
Executed: 2015-07-10
YUN, JAESUN
Executed: 2015-07-10
LIM, JOON-SUNG
Executed: 2015-07-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device with an Interconnection Structure Having Interconnections with an Interconnection Density That Decreases Moving Away from a Cell Semiconductor Pattern