Patent Assignment
Reel/Frame 037199/0217
Assignment of Assignor's Interest
Recorded: 2015-12-03
Pages: 4
Assignors
WANG, LIANG
Executed: 2015-11-24
GAO, GUILIAN
Executed: 2015-11-23
SHEN, HONG
Executed: 2015-11-23
KATKAR, RAJESH
Executed: 2015-11-23
HABA, BELGACEM
Executed: 2015-12-02
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Multi-Chip Microelectronic Assembly with Built-Up Fine-Patterned Circuit Structure
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073508/0758 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0807 →