Patent Assignment
Reel/Frame 037203/0447
Assignment of Assignor's Interest
Recorded: 2015-12-03
Pages: 4
Assignors
CHOI, KWANG-SEONG
Executed: 2015-11-26
BAE, HYUN-CHEOL
Executed: 2015-11-26
EOM, YONG SUNG
Executed: 2015-11-26
LEE, JIN HO
Executed: 2015-11-26
LEE, HAKSUN
Executed: 2015-11-26
Assignee
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
161, GAJEONG-DONG, YUSEONG-GU, DAEJEON, 305-700, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating a Semiconductor Package