Patent Assignment
Reel/Frame 037208/0429
Change of Name
Recorded: 2015-12-03
Pages: 14
Assignor
TSMC SOLID STATE LIGHTING LTD.
Executed: 2015-04-02
Assignee
CHIP STAR LTD.
NO. 9 LIXING 4TH RD., HSINCHU SCIENCE AND INDUSTRIAL PARK, HSINCHU CITY, TAIWAN
Covered Properties
(10)
Apparatus and Method for Wafer Level Classification of Light Emitting Device
Light Color and Intensity Adjustable Led
Thermal management system for multiple heat source devices
Light-Emitting Diode (Led) Module with Light Sensor Configurations for Optical Feedback
Methods of Fabricating Light Emitting Diode Devices
Light Emitting Diode with a Micro-Structure Lens Having a Ridged Surface
Light Emitting Diode Carrier
Led Structure Having Embedded Zener Diode
Color Temperature Adjustment for Led Lamps Using Switches
Changing Led Light Output Distribution Through Coating Configuration
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 22, 2011
From: CHEN, YUNG-CHANG; WU, HSIN-HSIEN; CHERN, CHYI SHYUAN; HSIAO, CHING-WEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025997/0426 →
Merger
Dec 3, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037457/0521 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →