Patent Assignment
Reel/Frame 037213/0188
Assignment of Assignor's Interest
Recorded: 2015-12-04
Pages: 2
Assignors
WU, CHIH-WEI
Executed: 2015-09-30
LIN, JING-CHENG
Executed: 2015-10-01
LU, SZU-WEI
Executed: 2015-09-30
SHIH, YING-CHING
Executed: 2015-09-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Chip Packages and Methods of Manufacture Thereof