Patent Assignment
Reel/Frame 037222/0177
Assignment of Assignor's Interest
Recorded: 2015-12-07
Pages: 7
Assignors
BAI, KEUN HEE
Executed: 2015-10-04
YEO, KYOUNG HWAN
Executed: 2015-10-03
HA, SEUNG SEOK
Executed: 2015-10-03
PARK, SEUNG JU
Executed: 2015-10-03
KIM, DO HYOUNG
Executed: 2015-10-04
KIM, MYEONG CHEOL
Executed: 2015-10-04
KOO, JAE HYOUNG
Executed: 2015-10-03
PARK, KI BYUNG
Executed: 2015-10-05
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Manufacturing Semiconductor Device