Patent Assignment
Reel/Frame 037244/0922
Assignment of Assignor's Interest
Recorded: 2015-12-09
Pages: 3
Assignors
CHEN, WEI-MING
Executed: 2015-10-20
HU, HSIEN-PIN
Executed: 2015-10-23
HOU, SHANG-YUN
Executed: 2015-10-23
WEI, WEN HSIN
Executed: 2015-10-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Stacked Integrated Circuit Structure and Method of Forming