Patent Assignment
Reel/Frame 037245/0509
Assignment of Assignor's Interest
Recorded: 2015-12-09
Pages: 7
Assignors
YOON, CHAN-SIC
Executed: 2015-11-02
PAK, JIUNG
Executed: 2015-11-02
LEE, KISEOK
Executed: 2015-11-02
PARK, CHAN HO
Executed: 2012-11-02
JUNG, HYEONOK
Executed: 2015-11-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Forming Semiconductor Devices Using Auxiliary Layers for Trimming Margin