Patent Assignment
Reel/Frame 037248/0220
Assignment of Assignor's Interest
Recorded: 2015-12-09
Pages: 4
Assignors
PENG, CHAO-HSIEN
Executed: 2015-09-15
LU, CHIH WEI
Executed: 2015-09-15
LEE, MING-HAN
Executed: 2015-09-15
SHUE, SHAU-LIN
Executed: 2015-09-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of Forming Metal Interconnection