IP Library › Assignment 037260/0314
Patent Assignment
Reel/Frame 037260/0314

Assignment of Assignor's Interest

Recorded: 2015-12-10 Pages: 3
Assignor
SHI, JIANGEN
Executed: 2015-12-07
Assignee
NANTONG FUJITSU MICROELECTRONICS CO., LTD.
NO. 288, CHONGCHUAN ROAD, NANTONG, 226006, CHINA
Covered Property (1)
Method and Structure for Wafer-Level Packaging
Patent: 9,437,511 →
Application: 14/964,869 →
Publication: US 2016/0172263
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 17, 2017
From: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
To: TONGFU MICROELECTRONICS CO., LTD.
Reel/Frame 041381/0374 →