IP Library Assignment 037276/0783
Patent Assignment
Reel/Frame 037276/0783

Assignment of Assignor's Interest

Recorded: 2015-12-11 Pages: 5
Assignors
ZHANG, ZHICHAO
Executed: 2015-12-01
AYGUN, KEMAL
Executed: 2015-12-01
SANKMAN, ROBERT L.
Executed: 2015-12-07
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Chip-To-Chip Interconnect with Embedded Electro-Optical Bridge Structures
Patent: 9,971,089 →
Application: 14/964,426 →
Publication: US 2017/0168235