Patent Assignment
Reel/Frame 037281/0648
Assignment of Assignor's Interest
Recorded: 2015-12-14
Pages: 3
Assignor
NAH, JAE-WOONG
Executed: 2015-12-13
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Solder Bumps Formed on Wafers Using Preformed Solder Balls with Different Compositions and Sizes