IP Library Assignment 037282/0141
Patent Assignment
Reel/Frame 037282/0141

Assignment of Assignor's Interest

Recorded: 2015-12-14 Pages: 4
Assignors
MURRAY, CONAL E.
Executed: 2015-12-11
YANG, CHIH-CHAO
Executed: 2015-12-13
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Semiconductor Device Interconnect Structures Formed by Metal Reflow Process
Patent: 9,735,051 →
Application: 14/967,618 →
Publication: US 2017/0170062