Patent Assignment
Reel/Frame 037302/0278
Assignment of Assignor's Interest
Recorded: 2015-12-16
Pages: 2
Assignors
CHEN, HSIEN-WEI
Executed: 2015-11-17
SU, AN-JHIH
Executed: 2015-11-17
LIN, TSUNG-SHU
Executed: 2015-11-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Integrated Fan-Out Structure and Method of Forming