Patent Assignment
Reel/Frame 037313/0690
Assignment of Assignor's Interest
Recorded: 2015-12-17
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Package Structures and Method of Forming the Same