Patent Assignment
Reel/Frame 037315/0700
RELEASE OF SECURITY INTEREST
Recorded: 2015-12-17
Received: 2015-12-17
Pages: 8
Assignor
BARCLAYS BANK PLC, AS COLLATERAL AGENT
Executed: 2015-12-17
Assignees
SPANSION LLC
915 DEGUIGNE DRIVE, SUNNYVALE, CA, 94088, UNITED STATES
SPANSION INC.
915 DEGUIGNE DRIVE, SUNNYVALE, CA, 94088, UNITED STATES
SPANSION TECHNOLOGY LLC
915 DEGUIGNE DRIVE, SUNNYVALE, CA, 94088, UNITED STATES
SPANSION TECHNOLOGY INC.
915 DEGUIGNE DRIVE, SUNNYVALE, CA, 94088, UNITED STATES
Covered Applications
(19)
MEMORY DEVICE HAVING TRAPEZOIDAL BITLINES AND METHOD OF FABRICATING SAME
App. No. 13/357,252
→
METHOD FOR FORMING NARROW STRUCTURES IN A SEMICONDUCTOR DEVICE
App. No. 13/044,313
→
SYSTEM AND METHOD FOR IMPROVING MESA WIDTH IN A SEMICONDUCTOR DEVICE
App. No. 12/910,331
→
PLANARIZATION METHOD USING HYBRID OXIDE AND POLYSILICON CMP
App. No. 12/887,182
→
METHODS FOR FABRICATING DUAL BIT FLASH MEMORY DEVICES
App. No. 12/765,646
→
MEMORY DEVICE ETCH METHODS
App. No. 12/688,477
→
METAL-INSULATOR-METAL-INSULATOR-METAL (MIMIM) MEMORY DEVICE
App. No. 11/521,219
→
METHODS FOR FABRICATING FLASH MEMORY DEVICES
App. No. 11/412,365
→
METHODS FOR FABRICATING DUAL BIT FLASH MEMORY DEVICES
App. No. 11/410,695
→
GAP-FILLING WITH UNIFORM PROPERTIES
App. No. 11/408,086
→
METHOD OF FORMING A CONTACT IN A SEMICONDUCTOR DEVICE WITH ENGINEERED PLASMA TREATMENT PROFILE OF BARRIER METAL LAYER
App. No. 11/388,976
→
INTEGRATED CIRCUIT CONTACT SYSTEM
App. No. 11/286,173
→
SYSTEM AND METHOD FOR IMPROVING RELIABILITY IN A SEMICONDUCTOR DEVICE
App. No. 11/186,969
→
BURIED SILICIDE LOCAL INTERCONNECT WITH SIDEWALL SPACERS AND METHOD FOR MAKING THE SAME
App. No. 11/136,569
→
SYSTEM AND METHOD FOR IMPROVING OXIDE-NITRIDE-OXIDE (ONO) COUPLING IN A SEMICONDUCTOR DEVICE
App. No. 11/128,389
→
ORDERED POROSITY TO DIRECT MEMORY ELEMENT FORMATION
App. No. 11/110,165
→
FILM STACKS TO PREVENT UV-INDUCED DEVICE DAMAGE
App. No. 11/091,524
→
ULTRAVIOLET RADIATION BLOCKING INTERLAYER DIELECTRIC
App. No. 11/091,519
→
NON-VOLATILE MEMORY DEVICE WITH IMPROVED ERASE SPEED
App. No. 11/049,855
→