Patent Assignment
Reel/Frame 037317/0016
Assignment of Assignor's Interest
Recorded: 2015-12-17
Pages: 4
Assignor
VERTICAL CIRCUITS, INC.
Executed: 2012-10-23
Assignee
VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
1100 LA AVENIDA STREET, MOUNTAIN VIEW, CALIFORNIA, 94043
Covered Property
(1)
Semiconductor Die Mount by Conformal Die Coating
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 16, 2015
From: CRANE, SCOTT JAY; MCELREA, SIMON J. S.; MCGRATH, SCOTT; PAN, WEIPING
To: VERTICAL CIRCUITS, INC.
Reel/Frame 037306/0227 →
Assignment of Assignor's Interest
Dec 28, 2015
From: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
To: INVENSAS CORPORATION
Reel/Frame 037364/0123 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →