Semiconductor die mount by conformal die coating
A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.
1. A method for affixing a die onto a support, comprising: placing the die onto the support; providing a standoff between a die attach surface of the die and a die mount surface of the support; and conformally coating to coat at least the die attach surface of the die and the die mount surface of the support including forming a polymer in situ with vapor deposition in a space between the die attach surface of the die and the die mount surface of the support.
2. The method of claim 1 , wherein the polymer includes an organic polymer on the die attach surface of the die and the die mount surface of the support.
3. The method of claim 1 , wherein the polymer includes a p-xylene or a derivative thereof on the die attach surface of the die and the die mount surface of the support.
4. The method of claim 1 , wherein the polymer includes a polyxylylene polymer on the die attach surface of the die and the die mount surface of the support.
5. The method of claim 1 , wherein the polymer includes a parylene selected from the group consisting of a parylene C, a parylene N, a parylene A, a parylene SR on the die attach surface of the die and the die mount surface of the support.
6. The method of claim 1 , further comprising: differentially cooling the die attach surface of the die and the die mount surface of the support.
7. A method for affixing a die onto a support, comprising: placing the die onto the support; providing a standoff with dielectric spacers between a die attach surface of the die and a die mount surface of the support; and conformally coating to coat at least the die attach surface and the die mount surface, wherein the conformally coating comprises forming a polymer in situ with vapor deposition in a space between the die attach surface of the die and the die mount surface of the support.
8. The method of claim 7 , wherein the polymer includes an organic polymer on the die attach surface of the die and the die mount surface of the support.
9. The method of claim 7 , further comprising: differentially cooling the die attach surface of the die and the die mount surface of the support.
10. The method of claim 7 , wherein the dielectric spacers provide adhesion between the die and the support for the conformally coating.
11. The method of claim 7 , wherein the dielectric spacers comprise a glass or an organic polymer.
12. The method of claim 7 , wherein the dielectric spacers have a nominal height in a range of about 5 μm to about 40 μm.
13. The method of claim 7 further comprising: selectively removing portions of a passivation layer and leaving spots of the passivation layer to serve as the dielectric spacers, wherein the passivation layer covers at least an active surface of the die.
14. A method for affixing a die onto a support, comprising: placing the die onto the support; providing a standoff between a die attach surface of the die and a die mount surface of the support; and a conformally coating to coat at least the die attach surface and the die mount surface, wherein the conformally coating comprises forming a polymer in situ with vapor deposition to fill a gap between the die attach surface of the die and the die mount surface of the support.
15. The method of claim 14 , wherein the polymer includes a p-xylene or a derivative thereof on the die attach surface of the die and the die mount surface of the support.
16. The method of claim 14 , wherein the polymer includes an organic polymer on the die attach surface of the die and the die mount surface of the support.
17. The method of claim 14 , further comprising: differentially cooling the die attach surface of the die and the die mount surface of the support.