Semiconductor die mount by conformal die coating
View Patent ↗A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.
1. A method for affixing a die onto a support, comprising providing a first die having a conformal coating on a surface thereof, providing a support having a conformal coating on a surface thereof, contacting a die attach area of the conformal coating on the first die directly with a die mount region of the conformal coating on the support, wherein the conformal coatings on the surfaces of the die and the support are of polyxylylene polymer material, and accomplishing adhesion of the die attach area with the die mount region of the support by heating at least one of the die attach area of the conformal coating on the first die or the die mount region of the conformal coating on the support to a temperature sufficient to affect adhesion.
2. The method of claim 1 wherein the heating procedure follows the contacting procedure.
3. The method of claim 2 wherein the contacting procedure follows the heating procedure.
4. The method of claim 1 , wherein the polyxylylene polymer is a parylene selected from the group consisting of a parylene C, a parylene N, a parylene A, and a parylene SR.
5. The method of claim 4 , wherein heating the die attach region includes heating the conformal coating to a temperature of about 120 to 230 degrees Celsius.
6. The method of claim 4 , wherein heating the die attach region includes heating the conformal coating to a temperature of about 175 to 200 degrees Celsius.
7. The method of claim 4 , wherein heating the die attach region includes heating the conformal coating to a temperature of about 125 to 150 degrees Celsius.
8. The method of claim 4 , further comprising applying pressure between the first die and support.
9. The method of claim 8 , wherein the pressure is about 5N per square cm.
10. The method of claim 1 , further comprising providing a second die having a conformal coating on a surface thereof, contacting a die attach area of the conformal coating of the second die with a die mount region of the first die, and heating the die attach area of the conformal coating of the second die.
11. The method of claim 10 , further comprising electrically connecting the first and second die to the support via one of an electrically conductive epoxy or electrically conductive ink.
12. The method of claim 1 , wherein the support is a second die.
13. The method of claim 12 , further comprising contacting a die attach area of the conformal coating of the second die with a die mount region on a non-die support, and heating the die attach area of the conformal coating of the second die.
14. The method of claim 13 , further comprising electrically connecting the first and second die to the support via one of an electrically conductive epoxy or electrically conductive ink.
15. The method of claim 1 , wherein the heating comprises heating both the die attach area of the conformal coating on the first die and the die mount region of the conformal coating on the support.