Patent Assignment
Reel/Frame 037322/0805
Assignment of Assignor's Interest
Recorded: 2015-12-18
Pages: 7
Assignors
HEO, JINSEONG
Executed: 2015-12-15
LEE, KIYOUNG
Executed: 2015-12-15
LEE, SANGYEOB
Executed: 2015-12-15
LEE, EUNKYU
Executed: 2015-12-15
LEE, JAEHO
Executed: 2015-12-15
PARK, SEONGJUN
Executed: 2015-12-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Two-Dimensional Material, and Method of Manufacturing the Semiconductor Device