Assignment of Assignor's Interest

Recorded: 2015-12-19 Pages: 2

Assignors

UEMATSU, YUTAKA

Executed: 2015-09-18

NAGATOMO, HIROYUKI

Executed: 2015-09-24

MASUKAWA, JUNICHI

Executed: 2015-09-24

Assignee

HITACHI METALS, LTD.

2-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN

Covered Property (1)

Circuit Substrate for Semiconductor Package with Multiple Circuit Substrate Units and Semiconductor Package Therefor

Patent: 9,773,738 →

Application: 14/874,242 →

Publication: US 2016/0099197

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.