Patent Assignment
Reel/Frame 037336/0212
Assignment of Assignor's Interest
Recorded: 2015-12-21
Pages: 4
Assignors
YUAN, CHIA-HSIANG
Executed: 2015-11-06
CHANG, CHIA-WEI
Executed: 2015-11-06
LIN, KUO-TING
Executed: 2015-11-06
CHUANG, YONG-CHENG
Executed: 2015-11-06
Assignee
POWERTECH TECHNOLOGY INC.
NO.26, DATONG RD., HUKOU TOWNSHIP,, HSINCHU COUNTY, 303, TAIWAN
Covered Property
(1)
Method of Forming Package Structure with Dummy Pads for Bonding