Patent Assignment
Reel/Frame 037338/0241
Assignment of Assignor's Interest
Recorded: 2015-12-21
Pages: 3
Assignor
SHI, LEI
Executed: 2015-12-18
Assignee
NANTONG FUJITSU MICROELECTRONICS CO., LTD.
NO. 288 CHONGCHUAN ROAD, NANTONG, 226006, CHINA
Covered Property
(1)
Method and Structure for Fan-Out Wafer Level Packaging
Application:
14/975,894 →
Publication:
US 2016/0189983
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.