IP Library › Assignment 037338/0265
Patent Assignment
Reel/Frame 037338/0265

Assignment of Assignor's Interest

Recorded: 2015-12-21 Pages: 21
Assignors
NORIYUKI, MASAKI
Executed: 2015-12-09
TSUTSUMI, TAKUYA
Executed: 2015-12-09
MASAHIRO, TANIZAKI
Executed: 2015-12-09
KITADA, SUSUMU
Executed: 2015-12-09
SUGIO, OSAMU
Executed: 2015-12-09
KOREEDA, HIDEMASA
Executed: 2015-12-09
FUJIHARA, TETSUO
Executed: 2015-12-09
Assignee
HANWHA TECHWIN CO., LTD.
1204, CHANGWON-DAERO, SEONGSAN-GU, GYEONGSANGNAM-DO, CHANGWON-SI, KOREA, REPUBLIC OF
Covered Property (1)
Part Holding Head Assembly for Chip Mounting Device
Patent: 9,435,685 →
Application: 14/874,692 →
Publication: US 2016/0096277
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 1, 2019
From: HANWHA TECHWIN CO., LTD.
To: HANWHA AEROSPACE CO., LTD.
Reel/Frame 048478/0831 →
Assignment of Assignor's Interest Apr 10, 2019
From: HANWHA AEROSPACE CO., LTD.
To: HANWHA PRECISION MACHINERY CO., LTD.
Reel/Frame 048853/0048 →