IP Library Assignment 037346/0888
Patent Assignment
Reel/Frame 037346/0888

Assignment of Assignor's Interest

Recorded: 2015-12-22 Pages: 4
Assignors
NOMURA, YUTAKA
Executed: 2015-12-08
WATASE, YUSUKE
Executed: 2015-12-08
OGIHARA, HIROKUNI
Executed: 2015-12-08
SAKAMOTO, NORIHIKO
Executed: 2015-12-08
FUJIMOTO, DAISUKE
Executed: 2015-12-08
MURAI, HIKARI
Executed: 2015-12-16
Assignee
HITACHI CHEMICAL COMPANY, LTD
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Film-Like Epoxy Resin Composition, Method of Producing Film-Like Epoxy Resin Composition, and Method of Producing Semiconductor Device
Patent: 9,873,771 →
Application: 14/894,645 →
Publication: US 2017/0073481
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →